The Community for Technology Leaders
RSS Icon
Subscribe
Issue No.04 - April (1993 vol.26)
pp: 23-29
ABSTRACT
<p>A high-density interconnection (HDI) technology that involves placing bare chips into cavities on a base substrate and fabricating the thin-film interconnect structure on top of the components is described. The interconnects to the chip I/O pads are formed as part of the thin-film fabrication process, thus eliminating the need for wire bonds, tape-automated bonds (TABs), or solder bumps. The need for advanced packaging and interconnection and the standard chips-last multichip module (MCM) technologies are reviewed. The HDI chips-first MCM technology's IC pretest requirements and approaches, substrate and packaged parts test, and substrate packaging are discussed.</p>
CITATION
Wolfgan Daum, William E. Burdick, Jr., Raymond A. Fillion, "Overlay High-Density Interconnect: A Chips-First Multichip Module Technology", Computer, vol.26, no. 4, pp. 23-29, April 1993, doi:10.1109/2.206510
28 ms
(Ver 2.0)

Marketing Automation Platform Marketing Automation Tool