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Overlay High-Density Interconnect: A Chips-First Multichip Module Technology
April 1993 (vol. 26 no. 4)
pp. 23-29

A high-density interconnection (HDI) technology that involves placing bare chips into cavities on a base substrate and fabricating the thin-film interconnect structure on top of the components is described. The interconnects to the chip I/O pads are formed as part of the thin-film fabrication process, thus eliminating the need for wire bonds, tape-automated bonds (TABs), or solder bumps. The need for advanced packaging and interconnection and the standard chips-last multichip module (MCM) technologies are reviewed. The HDI chips-first MCM technology's IC pretest requirements and approaches, substrate and packaged parts test, and substrate packaging are discussed.

Citation:
Wolfgan Daum, William E. Burdick, Jr., Raymond A. Fillion, "Overlay High-Density Interconnect: A Chips-First Multichip Module Technology," Computer, vol. 26, no. 4, pp. 23-29, April 1993, doi:10.1109/2.206510
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