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Issue No.04 - April (1993 vol.26)
pp: 13-21
ABSTRACT
<p>The signal processor packaging design (SPPD) general-purpose digital signal processor (DSP) architecture is discussed. SPPD is a highly modular processor architecture that is based on off-the-shelf components and that supports a multichip module (MCM) design implementation that delivers 400 million floating-point operations per second in a 75-g package. The interconnect-substrate design, MCM package assembly, MCM testing, and tradeoffs in size, weight, and cost of the SPPD packaging are described.</p>
CITATION
Robert K. Scannell, John K. Hagge, "Development of a Multichip Module DSP", Computer, vol.26, no. 4, pp. 13-21, April 1993, doi:10.1109/2.206508
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