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Issue No.12 - December (1992 vol.25)
pp: 67-68
ABSTRACT
<p>Advanced packaging is shifting to greater use of multichip modules (MCMs) for applications, not just those running on mainframes. It is argued that the reasons are threefold: higher performance, smaller size, and lower cost.</p>
CITATION
J.W. Balde, "Trends in Advanced Packaging Technology", Computer, vol.25, no. 12, pp. 67-68, December 1992, doi:10.1109/2.179119
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