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Trends in Advanced Packaging Technology
December 1992 (vol. 25 no. 12)
pp. 67-68

Advanced packaging is shifting to greater use of multichip modules (MCMs) for applications, not just those running on mainframes. It is argued that the reasons are threefold: higher performance, smaller size, and lower cost.

Citation:
J.W. Balde, "Trends in Advanced Packaging Technology," Computer, vol. 25, no. 12, pp. 67-68, Dec. 1992, doi:10.1109/2.179119
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