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Issue No.04 - April (1992 vol.25)
pp: 50-56
ABSTRACT
<p>The production of wafer-scale transducer arrays using laser interconnection techniques and micromatching technology is discussed. The design of a wafer-scale thermal dynamic scene simulator that was implemented using the laser-linking redundancy technique is presented to illustrate typical design requirements. The simulator uses small arrays of thermal pixels and control circuitry in 3 mu m CMOS technology.</p>
CITATION
Glenn H. Chapman, M. Parameswaran, Marek Syrzycki, "Wafer-Scale Transducer Arrays", Computer, vol.25, no. 4, pp. 50-56, April 1992, doi:10.1109/2.129048
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