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Issue No.04 - April (1987 vol.20)
pp: 21-35
J.F. McDonald , Rensselaer Polytechnic Institute
INDEX TERMS
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CITATION
J.F. McDonald, H.J. Greub, R.H. Steinvorth, B.J. Donlan, A.S. Bergendahl, "Wafer Scale Interconnections for GaAs Packaging-Applications to RISC Architecture", Computer, vol.20, no. 4, pp. 21-35, April 1987, doi:10.1109/MC.1987.1663533
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