This Article 
   
 Share 
   
 Bibliographic References 
   
 Add to: 
 
Digg
Furl
Spurl
Blink
Simpy
Google
Del.icio.us
Y!MyWeb
 
 Search 
   
Wafer Scale Interconnections for GaAs Packaging-Applications to RISC Architecture
April 1987 (vol. 20 no. 4)
pp. 21-35
Citation:
J.F. McDonald, H.J. Greub, R.H. Steinvorth, B.J. Donlan, A.S. Bergendahl, "Wafer Scale Interconnections for GaAs Packaging-Applications to RISC Architecture," Computer, vol. 20, no. 4, pp. 21-35, April 1987, doi:10.1109/MC.1987.1663533
Usage of this product signifies your acceptance of the Terms of Use.