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| "New Literature," Computer, vol. 10, no. 9, pp. 90, September, 1977. | |||
| BibTex | x | ||
| @article{ 10.1109/C-M.1977.217873, author = {}, title = {New Literature}, journal ={Computer}, volume = {10}, number = {9}, issn = {0018-9162}, year = {1977}, pages = {90}, doi = {http://doi.ieeecomputersociety.org/10.1109/C-M.1977.217873}, publisher = {IEEE Computer Society}, address = {Los Alamitos, CA, USA}, } | |||
| RefWorks Procite/RefMan/Endnote | x | ||
| TY - MGZN JO - Computer TI - New Literature IS - 9 SN - 0018-9162 SP EP EPD - 90 PY - 1977 KW - null VL - 10 JA - Computer ER - | |||
MICROELECTRONIC PACKAGING SYSTEMS AND HARDWARE. MUPAC Corporation is offering a 60-page brochure, covering their complete line of microelectronic packaging systems and hardware. Described are microelectronic wire wrap panels and rack assemblies, as well as all associated hardware, including cable assemblies, component carriers, frames, pre-cut stripped wire, and enclosures. Available from the company at 646 summer Street, Brockton, MA 02402.
Citation:
"New Literature," Computer, vol. 10, no. 9, pp. 90, Sept. 1977, doi:10.1109/C-M.1977.217873
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