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Spring-Bead Animation of Viscoelastic Materials
November/December 2007 (vol. 27 no. 6)
pp. 87-93
ASCII Text
x 
 
Nobuhiko Tamura, Toshiya Nakaguchi, Norimichi Tsumura, Yoichi Miyake, "Spring-Bead Animation of Viscoelastic Materials," IEEE Computer Graphics and Applications, vol. 27, no. 6, pp. 87-93, November/December, 2007.
 
 
BibTex
x
 
@article{ 10.1109/MCG.2007.157,
author = {Nobuhiko Tamura and Toshiya Nakaguchi and Norimichi Tsumura and Yoichi Miyake},
title = {Spring-Bead Animation of Viscoelastic Materials},
journal ={IEEE Computer Graphics and Applications},
volume = {27},
number = {6},
issn = {0272-1716},
year = {2007},
pages = {87-93},
doi = {http://doi.ieeecomputersociety.org/10.1109/MCG.2007.157},
publisher = {IEEE Computer Society},
address = {Los Alamitos, CA, USA},
}
 
 
RefWorks Procite/RefMan/Endnote
x 
 
TY - MGZN
JO - IEEE Computer Graphics and Applications
TI - Spring-Bead Animation of Viscoelastic Materials
IS - 6
SN - 0272-1716
SP87
EP93
EPD - 87-93
A1 - Nobuhiko Tamura,
A1 - Toshiya Nakaguchi,
A1 - Norimichi Tsumura,
A1 - Yoichi Miyake,
PY - 2007
KW - physically based animation
KW - viscoelastic materials
KW - computational fluid dynamics
KW - GPU
KW - particle system
VL - 27
JA - IEEE Computer Graphics and Applications
ER -
 
Nobuhiko Tamura, Chiba University
Toshiya Nakaguchi, Chiba University
Norimichi Tsumura, Chiba University
Yoichi Miyake, Chiba University
An interactive animation method for viscoelastic materials builds on Rouse's spring-bead model. Particles are connected one dimensionally by spring forces to represent single polymer chains. The method approximates the collision's force between particles through the particle density's gradient. This model lets the viscoelasticity be changed dynamically by severing the interconnection of polymer chains.

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Index Terms:
physically based animation, viscoelastic materials, computational fluid dynamics, GPU, particle system
Citation:
Nobuhiko Tamura, Toshiya Nakaguchi, Norimichi Tsumura, Yoichi Miyake, "Spring-Bead Animation of Viscoelastic Materials," IEEE Computer Graphics and Applications, vol. 27, no. 6, pp. 87-93, Nov.-Dec. 2007, doi:10.1109/MCG.2007.157
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